MICRO USB 5P B-F SMT CL=4.15相关参数： 
1. MATERIAL       
   HOUSING: LCP,UL94V
   CONTACT: COPPER ALLOY,
   SHELL:STAINLESS STEEL,T=0.3
   COVER:STAINLESS STEEL,T=0.25
2. FINISH
CONTACT: 50U" MIN NICKEL UNDERPLATING OVERALL
         GOLD PLATING SELECTIVE ON CONTACT AREA
         50U" MIN TIN PLATING ON SOLDER TAIL
SHELL: 40U" MIN NICKEL UNDERPLATING OVERALL
COVER: 40U" MIN NICKEL UNDERPLATING OVERALL
3. ELECTRICAL
   CURRENT: 1.0A
   VOLTAGE: 30V
   CONTACT RESISTANCE: 50 MILLIOHMS MAX.
   DIELECTRIC WITHSTANDING VOLTAGE: 500V AC
   INSULATION RESISTANCE: 100 MEGOHMS MIN.
4. MECHANICAL
   MATING FORCE: 35N MAX
   UNMATING FORCE: 10N MIN,INITIAL
                   8~20N AFTER 10000 CYCLES.
   URABILITY: 10000 CYCLES
5. PRODUCT NO. DESCRIPTION:

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